New nanotechnology allows the circuit board as thin as paper

Oregon State University has developed a new type of nanotechnology that allows for the lossless fusion of complex materials to create paper-thin circuit boards.

Nanometer particle fusion technology is not new, but due to over-reliance on high temperature during embedding process, the process will often have great damage, affecting the production process. The new technology will use photon technology, the use of xenon lamp instead of the traditional heat fusion operation, compared to 10 times the efficiency increase, thereby reducing long-term high-temperature fusion loss.

In short, if the technology has a market prospect, we can expect the future of mobile phones, tablet PCs, further reduce the size of the computer, it is looking forward to.

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